Description
Solder paste Sn63/Pb37 eutectic formula goes directly from a liquid to solid state as it cools and vise-versa. Great for reballing BGA chips with stencils, soldering connectors, and more!
Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Type: XGSP-50 Alloy: Sn63/Pb37 Microns: 20-38um